Conductor frame and housing for a radiation-emitting component, radiation-emitting component and display and/or illumination system using radiation-emitting components

ABSTRACT

Leadframe and housing for a radiation-emitting component, radiation-emitting component and display and/or illumination arrangement with radiation-emitting components  
     The invention describes a leadframe for a surface-mountable radiation-emitting component, preferably a light-emitting diode component, having at least one chip connection region and at least one external connection strip, the leadframe being formed in planar fashion and a deformation element, preferably a spring element, being arranged between the chip connection region and the external connection strip, said element enabling an elastic or plastic deformation of the leadframe in the plane of the leadframe. A housing, a surface-mountable component and an arrangement having a plurality of such components are furthermore specified.

[0001] The invention relates to a leadframe according to the preamble of patent claim 1, a housing according to the preamble of patent claim 15, a radiation-emitting component according to the preamble of patent claim 26, and to a display and/or illumination arrangement with radiation-emitting components according to the preamble of patent claim 31.

[0002] A radiation-emitting component of the type mentioned is illustrated diagrammatically in FIG. 7 and described for example in EP 0 400 176 A1. The component has a housing base body 31 with a mounting area 32, in which a leadframe 33 is embedded. Parts of the leadframe 33 are formed as connection strips which project from the housing base body 31 and, as they proceed further, are bent such that their connection areas 34 lie in one plane with the mounting area 32, which defines the mounting plane of the component. The bends 35 in the connection strips impart certain elastic properties to the connection strips, so that, on the one hand, a stable, tilting-free bearing of the component, for example on a printed circuit board, is ensured and, on the other hand, mechanical stresses which may arise in particular when the component is soldered in are elastically absorbed. Since changes in temperature are generally unavoidable when the component is soldered in and also during operation or avoiding them at least requires a high outlay, a certain elasticity of the component, in particular a flexibility of the connection strips, cannot be dispensed with.

[0003] Furthermore, the connection strips have to be formed such that components which are packed as bulk material do not interlock in one another. Finally, a sufficiently stable fixing of the component has to be ensured by the connection strips.

[0004] However, the known bent embodiment of the connection strips increases the space requirement for such a component both vertically and horizontally. In the horizontal direction, a certain minimum distance between the connection areas 34 and the housing base body 31 is prescribed by the stretched S-shaped bends 35. Reducing said minimum distance would require a higher degree of bending of the leadframe 33 and thus increase the risk of components interlocking in one another. Moreover, the bend 35 of the leadframe 33 toward the mounting area 32 of the component increases the volume taken up by the component and defines the minimum height of the component in its mounted state.

[0005] The space requirement is to be kept as small as possible in the case of very small structural forms which, for example, are intended to enable a high packing density and/or planar design and/or a mounting in round conductor track holes, that is to say holes.

[0006] It is an object of the present invention to specify a leadframe and a housing for a radiation-emitting surface-mountable component and a radiation-emitting surface-mountable component and also a display and/or illumination arrangement having radiation-emitting surface-mountable components with a small space requirement in each case. In particular, it is an object of the invention to provide a leadframe which additionally has a sufficient elasticity in conjunction with sufficient mechanical stability.

[0007] This object is achieved by means of the subject matter of patent claims 1, 15, 26 and 31. The dependent claims relate to advantageous developments of the invention.

[0008] The invention is based on the idea of forming the leadframe for a radiation-emitting component in planar fashion to the greatest possible extent in particular in the region outside a housing, and in the process forming it so as to elastically or plastically absorb strains resulting from deformation in the plane of the leadframe. In this case, parts of the leadframe at the same time form the bearing area of the component.

[0009] The invention provides, in particular, for forming a leadframe for a surface-mountable radiation-emitting component, for example of a light-emitting diode, which has at least one chip connection region and at least one external connection strip, the leadframe being formed in planar fashion and a deformation element being arranged between the chip connection region and the external connection strip, said deformation element enabling an elastic or plastic deformation of the leadframe in the plane of the leadframe. The deformation element is preferably embodied as a spring element.

[0010] In an advantageous refinement of the invention, the leadframe has two or more connection strips, a deformation element or spring element in each case being arranged between connection strip and the chip connection region.

[0011] The planar embodiment of the leadframe advantageously makes it possible to form a component which has, perpendicular to the leadframe plane, only very small housing extents and only very small space requirements. Furthermore, the external connection area of the component can be arranged near to the component housing since the horizontal space requirement is very small on account of the planar embodiment. In this case, the deformation or spring elements ensure a sufficient flexibility relative to strains and deformations as may arise for example during the soldering-in process or on account of thermal loading during operation of the component.

[0012] The invention's embodiment of the leadframe, housing and component advantageously makes it possible to avoid having to bend leadframe parts only after production of a component housing. This is of importance particularly in the case of housing bodies produced by encapsulation by molding or encapsulation by injection-molding. The risk of delamination of housing and leadframe is thereby reduced, the advantage afforded by this being intensified particularly in the case of greatly miniaturized housings.

[0013] In an advantageous development of the invention, the deformation element is formed as a spring strip which is sufficiently narrow to ensure the required flexibility of the leadframe. Said deformation element is preferably made narrower than the adjoining connection strip and runs transversely with respect to the main direction of extent of the leadframe. What is achieved by this course of the spring strip is that mechanical stresses in the plane of the leadframe can be well cushioned largely independently of their direction. Furthermore, this embodiment enables the leadframe to be produced simply and cost-effectively by stamping out the leadframe from a metal sheet or a foil. Connection strips and adjoining deformation elements and also parts of the chip connection region are formed in one piece in this case and can be stamped from a metal sheet or a film in one work step.

[0014] In an advantageous development of the invention, the connection strip has a projection and/or a housing body has a projection or a groove which enables the connection strip to project into the housing body. This reduces the risk of bending of the leadframe or of the connection strips perpendicularly to the leadframe plane.

[0015] The chip connection region is preferably embodied in two parts with a chip connection part and a wire connection part, the chip connection part being provided for mounting a radiation-emitting chip. Further contact is made with the chip by means of a wire connection to the wire connection part.

[0016] Between the deformation or spring element and the chip connection region, the leadframe preferably has at least one holding element for fixing the chip connection region in a component housing. This serves in particular for strain relief of the chip connection region. Such a holding element is realized for example by means of a cutout or a hole in the leadframe, into which the component housing engages.

[0017] In an advantageous refinement of the invention, the leadframe is partly embedded in a housing, the deformation or spring elements with the adjoining connection strips being led out of the housing. Furthermore, the housing may have a radiation exit window in the form of a suitably formed recess in which the chip connection region of the leadframe is arranged. The side areas of the radiation exit window are preferably formed as a radiation reflector. As an alternative, the housing may also comprise a radiation-transmissive material and completely enclose the radiation-emitting chip.

[0018] A preferred development of a housing according to the invention has peripheral projections which, in plan view, partly overlap the deformation or spring elements of the leadframe. This advantageously reduces the risk of bending of the connection strips or of the deformation or spring elements perpendicularly to the leadframe plane.

[0019] In addition or as an alternative, it is possible to form projections at the connection strips, as already described, which project into the housing body.

[0020] In a particularly preferred embodiment, the housing body has an essentially circular or oval cross-sectional form parallel to the plane of the soldering connection strip.

[0021] In a radiation-emitting component according to the invention, a radiation-emitting chip, for example a semiconductor chip, is fixed on the chip connection region or the chip connection part of the leadframe. The semiconductor chip and parts of the leadframe are surrounded by a housing of the type described.

[0022] If the chip is arranged within a radiation exit window, then the latter may advantageously be filled with a transparent compound which encapsulates the chip, preferably a plastics compound. This encapsulation serves to protect the chip and additionally makes it possible to form an optical element arranged downstream of the radiation-emitting chip, for example in the form of a lens surface. Reaction resins such as epoxy resins, acrylic resins or silicone resins or a mixture of these resins are suitable, in particular, as the encapsulation.

[0023] Further features, advantages and expediencies of the invention are explained in more detail below using five exemplary embodiments.

[0024] In the figures

[0025]FIG. 1 shows a diagrammatic plan view of an exemplary embodiment of a leadframe according to the invention,

[0026]FIG. 2 shows a diagrammatic plan view of a first exemplary embodiment of a housing according to the invention,

[0027]FIGS. 3a, 3 b and 3 c show a diagrammatic plan view, side view and bottom view of a second exemplary embodiment of a housing according to the invention,

[0028]FIG. 4 shows a diagrammatic perspective view of an exemplary embodiment of a component according to the invention,

[0029]FIG. 5 shows a diagrammatic sectional view of a first exemplary embodiment of a multiple arrangement of radiation-emitting components according to the invention,

[0030]FIG. 6 shows a diagrammatic sectional view of a second exemplary embodiment of a multiple arrangement of radiation-emitting components according to the invention, and

[0031]FIG. 7 shows a surface-mountable component according to the prior art.

[0032] Identical or identically acting elements are provided with the same reference symbols in the figures.

[0033] The leadframe 1 illustrated in FIG. 1 is embodied in planar fashion and in two parts. The two leadframe parts 1 a and 1 b each have a connection strip 2 a, 2 b joined by a deformation element 3 a, 3 b. The deformation element is preferably embodied as a spring element.

[0034] From the deformation elements 3 a, 3 b the two leadframe parts 1 a, 1 b extend to a chip connection region 4. In this case, by way of example, one of the two leadframe parts 1 a projecting into the chip connection region 4 may be provided as chip connection part 14 with a mounting area for a chip, preferably a radiation-emitting semiconductor chip. The other leadframe part 1 b may correspondingly be formed as a wire connection part 13 and have a wire connection area which serves for making the electrical contact with the chip.

[0035] The deformation elements or spring elements 3 a, 3 b are embodied in the form of narrow strips, the width of which is narrower than the width of the adjoining connection strips 2 a, 2 b. These spring strips run perpendicular to the longitudinal axis 5 of the leadframe 1, which coincides with the main direction of extent of the leadframe.

[0036] The shaping described imparts a flexibility to the planar leadframe 1, so that strains in the leadframe plane, for example due to tension in the directions 7 a, 7 b shown, as may occur during or after the soldering-in process on account of different thermal expansion coefficients, are absorbed by means of the deformation elements 3 a, 3 b. This prevents, in particular, a transfer of the stresses to parts of a housing body 80 (indicated by the dashed contour in FIG. 1) in which such a leadframe is embedded, which stresses can lead to cracks or other kinds of damage of the housing.

[0037] Circular holes 6 a, 6 b are furthermore formed in the leadframe 1, which holes improve the retention of the leadframe in a housing. Correspondingly formed pins of a housing body 80 can be passed through said holes 6 a, 6 b, and prevent a displacement of the leadframe within the housing to the greatest possible extent. If the housing body 80 is formed for example at least partly by the leadframe 1 being encapsulated with a molding compound, for example by means of an injection-molding or transfer-molding method, then the molding compound fills the holes, thereby forming the above-mentioned pins, which, in the solid state, provide for the additional retention of the leadframe in the housing.

[0038] Furthermore, the connection strip 2 b has a projection 9, which enables the leadframe to be additionally projected into the housing body 80 and, in particular, serves to prevent bending of the connection strip 2 b and/or the adjoining deformation element 3 b out of the leadframe plane. In addition or as an alternative, a projection 10 at a housing may also serve for this purpose, as will be described in more detail below, said projection likewise preventing such bending.

[0039]FIG. 2 shows a diagrammatic plan view of an exemplary embodiment of a housing according to the invention for a radiation-emitting component.

[0040] In this case, a housing body 80 comprises a housing base body 8 which is largely rotationally symmetrical concerning the outer contour and has a circular contour in the illustration, in which a leadframe 1 is partly embedded. The leadframe 1, as in the previous exemplary embodiment, is formed in planar fashion and in two parts, the two leadframe parts each having an external connection strip 2 a, 2 b and an adjoining deformation element 3 a, 3 b and also a chip connection part 14 or respectively a wire connection part 13. Chip connection part 14 and wire connection part 13 are arranged at a distance from one another in a common chip connection region 4 in the housing.

[0041] Furthermore, a projection 9 a, 9 b is in each case formed at the connection strips 2 a, 2 b, which projection projects into the housing base body 8 and thus prevents bending of the leadframe 1 perpendicularly to the leadframe plane.

[0042] The housing base body 8 preferably comprises a molding compound and is produced by the leadframe 1 being encapsulated with said molding compound, for example by means of an injection-molding or transfer-molding method. In this case, the molding compound also fills the holes 6 a, 6 b and 6 c in the leadframe 1, thereby ensuring a mechanically stable anchoring of the leadframe 1 in the housing base body 8.

[0043] The housing base body 8 furthermore has a radiation exit window 12 in the form of a truncated-cone-like recess which extends in the direction of the main emission direction and into which the chip connection part 14 and the wire connection part 13 of the leadframe project, that is to say adjoin at least the internal space of the recess with a surface, and in particular form at least a part of the bottom area of the radiation exit window 12. For this purpose, a separate cutout 18 is formed in the radiation exit window 12, the base area of which cutout forms the chip connection region 4 and defines the mounting plane for a chip or a wire connection.

[0044] The side wall of the radiation exit window, which connects the bottom area of the recess to the outer area of the housing base body 8, is embodied in such a way that it acts as a reflector area for an electromagnetic radiation emitted by the chip 16. It may be planar or concave depending on the desired emission behavior.

[0045] The side wall is preferably embodied in such a way that the chip 16 is arranged centrally in the reflector well formed by it, and that it is particularly preferably led essentially as far as the mounting region for the chip on the leadframe 1. This last means that only this mounting region alone essentially represents the entire bottom area of the truncated-cone-like recess. In other words, the bottom area is preferably only as large as is necessary for the chip mounting. In order to achieve this to the greatest possible extent, a cutout 18 for a wire connection 17 from the wire connection part 13 to the chip 16 is provided in the side wall (see FIG. 4).

[0046]FIG. 3 shows a further exemplary embodiment of a housing according to the invention. FIG. 3a illustrates the bottom view, FIG. 3b the side view and FIG. 3c the plan view of the housing.

[0047] In contrast to the previously described exemplary embodiments, projections 10 a, 10 b and 10 c are arranged peripherally at the housing, and prevent bending of the leadframe 1 perpendicular to the leadframe plane (see FIGS. 3b and 3 c). The housing is provided in particular for an LED component. For the marking of the cathode connection of the leadframe 1, the housing has, on one side, a bevel 15 and also two separate housing projections 10 a, 10 c, while a single wider projection 10 b is integrally formed opposite.

[0048] In this case, the projections 10 a, 10 b and 10 c are arranged in such a way that, in the plan view and in the bottom view, they overlap the deformation or spring elements 3 a, 3 b and thus prevent vertical bending of the deformation elements.

[0049]FIG. 4 perspectively illustrates an exemplary embodiment of a radiation-emitting component according to the invention. The housing of the component corresponds to the previous exemplary embodiment. A radiation-emitting chip 16, for example a semiconductor chip such as a semiconductor LED or a semiconductor laser, is fixed, for example soldered or adhesively bonded by means of an electrically conductive adhesive, on that region of the base area of the radiation exit window 12 which is formed by the chip connection part 14.

[0050] On the front side remote from the leadframe 1, the semiconductor chip 16 has a contact area from which a wire connection 17 is led to the wire connection part 13. The oblique side area 11 of the radiation exit window 12 serves as a reflector for a radiation emitted by the semiconductor chip 16 toward the side.

[0051]FIG. 5 shows a multiple arrangement of components according to the invention. A plurality of holes 20 are formed in a carrier 19, for example a circuit board. Furthermore, the carrier has an emission side 21.

[0052] A plurality of radiation-emitting components according to the invention are fixed on the side of the carrier opposite to the emission side, in each case a part of the housing body 80 of a radiation-emitting component in accordance with FIG. 4 projecting into one of the holes 20 and the emission direction 24 running through the holes 20.

[0053] The connection strips 2 a, 2 b of the respective leadframes of the components lie on the surface of the carrier 19 opposite to the emission side 21. Adhesive bonding connections or soldering connections may serve for fixing the components. On account of the leadframe which is formed in planar fashion and, in particular, has no bends, the space requirement horizontally and vertically is significantly smaller than in the case of components according to the prior art. In particular, the invention enables a partly recessed mounting of the components.

[0054] On account of the deformation elements 3 a, 3 b formed for example as spring strips in the leadframe, the leadframe is sufficiently flexible to absorb strains and deformations elastically or plastically without harmful strains being transmitted to the housing or a radiation-emitting chip situated therein. This mounting arrangement is suitable in particular for densely packed flat display modules.

[0055] Preferably, the carrier or at least the emission-side surface is embodied such that it is radiation-absorbent, for example blackened, thereby increasing the contrast of the individual radiation-emitting components with respect to the surroundings. This is advantageous particularly in the case of multiple arrangements which are provided as a display apparatus.

[0056]FIG. 6 shows a further multiple arrangement of components according to the invention. In contrast to the preceding multiple arrangement, the multiple arrangement shown in FIG. 6 is suitable in particular as background illumination, for example for a liquid crystal display.

[0057] As in the previous exemplary embodiment, radiation-emitting components according to the invention are mounted in partly recessed fashion on a carrier 19. On the emission side, a diffusing plate 22 is arranged downstream of the carrier or the components. Furthermore, the carrier 19 or at least the emission-side surface of the carrier 19 is preferably embodied such that it is uniformly diffusely reflective, for example white. This enables a largely homogeneous backlighting in an extremely flat design. Arranged downstream of the diffusing plate is, for example, an LCD display 23 to be illuminated.

[0058] The carrier may be formed both, as described above, rigidly and flexibly, for example in the form of a plastic or a ceramic film, so that a backlighting or display module can be adapted in a simple manner to different forms and advantageously even be mounted at changing areas.

[0059] It goes without saying that the explanation of the invention on the basis of the exemplary embodiments shown is not be understood as a restriction of the invention. However, for example, the chip may be mounted, for example adhesively bonded, directly on a chip mounting area of the housing base body 8 and the chip may be electrically connected to the leadframe exclusively by means of wire connections. The chip may equally be mounted on a separate thermal connection embedded in the housing body, and again be electrically connected to the leadframe by means of wire connections. All these embodiments do not depart from the fundamental concept of the present invention. 

1. A leadframe (1) for a surface-mountable radiation-emitting component having at least one chip connection region (4) and at least one external soldering connection strip (2 a, 2 b) electrically connected to the latter, characterized in that a deformation element (3 a, 3 b) is formed between the chip connection region (4) and the soldering connection strip (2 a, 2 b), which deformation element runs completely in one and the same plane of the leadframe (1) as the soldering connection strip (2 a, 2 b) and in a direction parallel to a mounting plane of a component housing (8) enables a movement of the soldering connection strip relative to the chip connection region (4).
 2. The leadframe as claimed in claim 1, characterized in that the deformation element (3 a, 3 b) is a spring element.
 3. The leadframe as claimed in claim 1 or 2, characterized in that a holding element (6 a, 6 b) for fixing the chip connection region (4) in the component housing (8) is provided between the deformation element (3 a, 3 b) and the chip connection region (4).
 4. The leadframe as claimed in one of claims 1 to 3, characterized in that a further holding element (6 c) is arranged between the chip connection region (4) and the holding element (6 a, 6 b).
 5. The leadframe as claimed in claim 3 or 4, characterized in that the holding element or at least one of the holding elements (6 a, 6 b) is a hole or a cutout in the region between the deformation element (3 a, 3 b) and the chip connection region (4 a, 4 b) into which the component housing (8) engages.
 6. The leadframe as claimed in at least one of the preceding claims, characterized in that the deformation element (3 a, 3 b) or the soldering connection strip (2 a, 2 b) has a guide part (9, 9 a, 9 b), in particular a lug (9 a, 9 b), which is supported, in particular by the component housing (8), in such a way that it acts against a bending of the soldering connection strip (2 a, 2 b), in particular toward the front side of the housing.
 7. The leadframe as claimed in at least one of the preceding claims, characterized in that the leadframe (1) is formed in planar fashion.
 8. The leadframe as claimed in at least one of the preceding claims, characterized in that the leadframe (1) has two external connection strips (2 a, 2 b).
 9. The leadframe as claimed in claim 8, characterized in that a deformation element (3 a, 3 b) is arranged between each of the external connection strips (2 a, 2 b) and the associated chip connection region (4).
 10. The leadframe as claimed in one of the preceding claims, characterized in that the deformation element (3 a, 3 b) comprises a spring strip, whose strip width is less than the width of the adjoining connection strip (2 a, 2 b).
 11. The leadframe as claimed in claim 10, characterized in that the spring strip runs transversely with respect to the main direction of extent of the leadframe (1).
 12. The leadframe as claimed in one of the preceding claims, characterized in that the chip connection region (4) comprises a chip mounting part (14) and a wire connection part (13) arranged at a distance therefrom.
 13. The leadframe as claimed in one of the preceding claims, characterized in that the connection strip (2 a, 2 b), the deformation element (3 a, 3 b) and a partial region—assigned thereto—of the chip connection region (4) of the leadframe (1) are formed in one piece.
 14. The leadframe as claimed in one of the preceding claims, characterized in that the leadframe (1) is provided with a surface coating which improves the soldering or bonding properties.
 15. A housing for a radiation-emitting surface-mountable component, characterized in that it contains at least one leadframe (1) as claimed in one of claims 1 to
 14. 16. The housing as claimed in claim 15, characterized in that the leadframe (1) is embedded in a housing body (80) in such a way that the external connection strip (2 a, 2 b) and at least partly the deformation element (3 a, 3 b) project from it.
 17. The housing as claimed in claim 15 or 16, directly or indirectly referred back to claim 6, characterized in that at least one guide element, in particular a guide projection (10 a, 10 b, 10 c) or a guide groove, is provided at the housing body (80) and cooperates with the guide part (9, 9 a, 9 b) of the leadframe.
 18. The housing as claimed in one of claims 15 to 17, characterized in that the housing body (80) has a housing base body (8) in which the leadframe (1) is embedded in such a way that the external connection strip (2 a, 2 b) and at least partly the deformation element (3 a, 3 b) project from the housing base body (8).
 19. The housing as claimed in claim 18, characterized in that the housing base body (8) has an essentially circular or oval cross-sectional form parallel to the plane of the soldering connection strip (2 a, 2 b).
 20. The housing as claimed in one of claims 17 or 18, or as claimed in claims 17, 18 and 19, characterized in that the guide element is arranged at the housing base body (8), in particular is integrally formed with the latter.
 21. The housing as claimed in one of claims 15 to 20, characterized in that the housing body (80) or the housing base body (8) is produced from a molding compound, in particular from a thermoplastic material.
 22. The housing as claimed in one of claims 15 to 21, characterized in that the housing has a radiation exit window (12), in which the chip connection region (4) of the leadframe (1) is arranged.
 23. The housing as claimed in claim 22, characterized in that the radiation exit window (12) is bounded at least partly by side areas which are formed in such a way that they act as a radiation reflector (11) at least for part of a radiation emitted by a radiation source arranged in the radiation exit window (12).
 24. The housing as claimed in claim 17 or as claimed in one of claims 18 to 23 with reference back to claim 17, characterized in that the housing body (80) or the housing base body (8) has a projection (10) as guide element, said projection overlapping the deformation element (3 a, 3 b) or soldering connection strip (2 a, 2 b) to be supported.
 25. The housing as claimed in one of claims 15 to 24 with a leadframe as claimed in claim 6 or as claimed in one of claims 7 to 14 with reference back to claim 6, characterized in that the housing body (80) or the housing base body (8) has a groove into which projects the guide part (9, 9 a, 9 b) of the deformation element (3 a, 3 b) or of the soldering connection strip (2 a, 2 b).
 26. A surface-mountable radiation-emitting component, characterized in that it has a leadframe (1) as claimed in one of claims 1 to 14 and/or a housing as claimed in one of claims 15 to
 25. 27. The radiation-emitting component as claimed in claim 26, characterized in that a radiation-emitting chip (16) is fixed in the chip connection region (4 a, 4 b) on the leadframe (1) or, if appropriate, on the housing base body (8).
 28. The radiation-emitting component as claimed in claim 26 or 27, characterized in that the radiation-emitting chip (16) is a semiconductor chip.
 29. The radiation-emitting component as claimed in claim 27 or 28, characterized in that the chip (16) is at least partly encapsulated with a radiation-transmissive compound, in particular a plastics compound.
 30. The radiation-emitting component as claimed in claim 29, characterized in that the radiation-transmissive compound is a casting resin or a molding compound based on a reaction resin, in particular an epoxy resin, acrylic resin or silicone resin or a mixture of said resins.
 31. An arrangement having a plurality of radiation-emitting components as claimed in one of claims 26 to 30, characterized in that provision is made of a carrier (19) with a plurality of holes (20) and the radiation-emitting components are in each case fixed with the connection strips (2 a, 2 b) at a component side of the carrier in such a way that their housing body (80) or housing base body (8) in each case projects into or through one of the holes (20).
 32. The arrangement as claimed in claim 31, characterized in that the carrier (19) has an emission side (21) which is situated at the carrier's side opposite to the component side, and the components project into or through the holes (20) in each case with their front side.
 33. The arrangement as claimed in claim 32, characterized in that the emission-side surface of the carrier (19) is radiation-absorbent, in particular blackened.
 34. The arrangement as claimed in claim 32, characterized in that the emission-side surface of the carrier (19) is diffusely reflective, in particular white.
 35. The arrangement as claimed in one of claims 32 to 34, characterized in that a diffusing plate (22) is arranged downstream of the carrier (19) on the emission side.
 36. The arrangement as claimed in one of claims 32 to 35, characterized in that a liquid crystal display is arranged downstream of the carrier (19) on the emission side.
 37. The arrangement as claimed in one of claims 31 to 36, characterized in that the carrier (19) is formed in flexible fashion.
 38. The arrangement as claimed in one of claims 31 to 37, characterized in that electrical conduction structures are formed on the carrier (19). 